12431-CU

StrataTekâ„¢ Hexagonal Grids

Style

  • The StrataTekâ„¢ TEM grids for Transmission Electron Microscopy have a thickness of 25µm and are manufactured using a micron-precision etching process of thin foils. This method produces sturdy and rigid TEM grids. Both sides have the same surface characterization. StrataTekâ„¢ grids have a slightly higher density than grids made by electroplating. Corners where bars meet tend to be rounded.

    Available in coarser mesh sizes only, with configurations in square and hexagonal mesh, slot, hole and folding grids. Grids have standard diameter of 3.05mm.

    Packaging for all configurations is 100 Cu grids /vial.

    1. StrataTekâ„¢ Hexagonal Grids, 50 mesh, Copper, 100/vial
    2. StrataTekâ„¢ Hexagonal Grids, 75 mesh, Copper, 100/vial
    3. StrataTekâ„¢ Hexagonal Grids, 100 mesh, Copper, 100/vial
    4. StrataTekâ„¢ Hexagonal Grids, 150 mesh, Copper, 100/vial
    5. StrataTekâ„¢ Hexagonal Grids, 200 mesh, Copper, 100/vial
    6. StrataTekâ„¢ Hexagonal Grids, 230 mesh, Copper, 100/vial
  • Square Mesh Pitch µm Hole µm Bar µm % Transmission
    50 530 450 80 72
    75 350 300 50 73.5
    100 260 230 30 78
    150 180 140 40 60
    Hex Mesh
    50 530 450 80 72
    75 359 300 50 73.5
    100 260 230 30 78
    150 180 140 40 60
    200 130 100 30 59
    230 110 85 25 60