Wafer-Mount™ 559 A clear adhesive on a plastic film that is ideal for holding silicon wafers, alumina, or glass substrates for scribing. No heating is required; just remove the paper backing to expose the adhesive layer, position the wafer substrate on the film and press down with firm pressure to insure adhesion. A vacuum manifold or mechanical device may be used to hold wafer/plastic film during dicing or scribing. After dicing or scribing acetone or MEK may be used to separate the specimen from the Wafer-Mount™ 559. Size is 10" x 10" x 0.005" thick in packages of 2.
Ideal for scribing/dicing wafers with vacuum hold down fixturing.
|Size||0.005" x 10" x 10" (0.127mm x 254mm x 254mm)|
|Solvent||Acetone or MEK|