Wafer Cleaving / Glass Breaking Pliers

  • These light weight tweezers and pliers are non-absorbent, have a positive, gentle grip, are non-magnetic and the tips do not open when extra pressure is applied.
    They resist acetone, alcohol and most acids.
    Static dissipative (carbon fiber reinforced) versions are available for most models.
    Ideal for sample preparation, microscopy, etching, electronics, instrumentation, laboratories, forensics and delicate wafer handling.
    Especially useful for handling scratch- sensitive specimens and components, cleaning and etching processes.

    Wafer Cleaving / Glass Breaking Pliers - Wafer Cleaving / Glass Breaking Pliers, 6", including jaw inserts

    The wafer cleaving / Glass Breaking pliers are used to make clean breaks of silicon wafers, glass, quartz or thin ceramic tiles. They are also called glass pliers or running pliers.

    The pliers come with two sets of jaw inserts:
    1. one soft set to break out over a the scored line. A white line on the nose of the pliers helps with alignment of the breaking line.
    2. one flat metal set nipping along a parallel score line.

    Made of strong reinforced plastic, 6” overall length.

    General Advice for Selecting a Diamond Scribe
    The larger the tip/shaft diameter and the greater the included angle the more robust the scribe. Even the heavy duty shaft diamond point tools are meant for scribing light lines for marking or scoring for breaking. They are not meant for engraving or machining.


    For scribing to break the Deluxe Diamond Scribing Pen, Product No 54468, is ideal for a production environment where many people may be using the tool. It is more tolerant of untrained personnel who might over apply pressure that would break a more delicate tip.

    For personal use a more delicate scribe with a finer tip but a sturdy shaft and broad base (90º included angle) would be Product 54483 or 54484 depending on the scribe head angle desired. Next would be 54482 (60º included angle) for very delicate scribe to mark or break. Breaking of flat substrates is best facilitated using Product No. 7295, Wafer Cleaving/Glass Breaking Pliers.

    The Fine Point Scribes and Micro Tool Scribes are for very delicate scribing like marking identification on the back of a silicon wafer or glass slide. We don't recommend these for scribe to break applications where a deeper scribe mark may be required.