Ultra-Flat SiNx Coated Substrates

Ultra-Flat SiNx Coated Substrates
The Ultra-Flat SiNx Substrates consist of ultra-flat silicon wafers coated with 200nm of amorphous nonstoichiometric ultra-low-stress silicon nitride, similar to our silicon nitride grids. The ultra-flat SiNx substrates are available in 6" wafer and conveniently diced 5 x 5mm, 5 x 7mm, and 10 x 10mm chips. The 6" wafer is shipped in a 6" wafer carrier; the diced pieces are shipped in a Gel-Pak® Box.

The wafers are stealth diced, a special clean dicing process that produces debris-free substrates. All products are packed in class 10 clean room conditions.

21630-6 - 200nm SiNx on Ultra-Flat Silicon Wafer, in 6" wafer carrier
21630-55 - 200nm SiNx on Ultra-Flat Silicon Wafer, 5 x 5mm pieces in a Gel-Pak® box
21630-57 - 200nm SiNx on Ultra-Flat Silicon Wafer, 5 x 7mm pieces in a Gel-Pak® box
21630-510 - 200nm SiNx on Ultra-Flat Silicon Wafer, 10 x 10mm pieces in a Gel-Pak® box