Strong, highly conductive epoxy for solderless connections and repairs of circuit boards, static discharge shielding, grounding and conductive paths.
(Minimum bond temperature/time)
65 to 121°C (150 to 250°F) for 5 to 10 min.
25°C (75°F) for 4 hours
HAZARD WARNING GUIDES
|U||Unlisted as hazard; unknown hazard if any|