The thickness of the silicon lift-out grids is 100µm which makes them compatible with all standard TEM holders. Perfect half circular shape which fits nicely in the TEM grid holder. Debris-free, metal-free lift-out grids which readily bond with Pt to attach the lamellas. Straight edges, similar to the Cu and Mo grids; easy to handle. B-doped, conductive silicon minimizes charging during sample preparation and TEM imaging. Available with four narrow posts, which can be shaped if needed. Post size is 80 x 100 x 190µm (W x D x H). Sold in packs of 10.
PELCO® FIB Lift-Out TEM Grids – Available in Cu, Mo and Si
The PELCO® FIB Lift-Out TEM Grids have been designed for in-situ lift to attach the TEM lamellas milled out by SEM/FIB or FIB systems. The design has been optimized for access and flexibility. The nominal diameter of the sturdy PELCO® FIB Lift-Out Grids is 3mm. These grids fit an all standard TEM holders and provide a full view of the thin section attached to the posts.