Si-chips are opaque, of low electrical resistance and have surface properties equal to glass (including smoothness). They are also good substrates for growing or mounting cells. Si-chips are precleaned before packaging. Also ideal for imaging small particles due to low background signal.
4" wafer (#16010) is precut into 5 x 7mmm, 5 x 5mm, 10 x 10mm, 20 x 20 mm or 20 x 30mm chips that can be easily separated in the laboratory.
4" wafer precut into 5 x 7mm chips approximately 187 chips/wafer
4" wafer precut into 5 x 5mm chips approximately 270 chips/wafer
4" wafer precut into 10 x 10mm chips approximately 55 chips/wafer
4" wafer precut into 20 x 20mm chips approximately 10 chips/wafer
4" wafer precut into 20 x 30mm chips approximately 6 chips/wafer
Orientation: <100>
Resistance: 1-30 Ohms
Type: P (Boron) (1 primary flat)
No SiO2 top coating
Wafer thickness: 18-21 mil (460-530µm)
Wafer is polished on one side
Roughness: 2nm
Before dicing they are rinsed in de-ionized water for cleaning
