PELCO® Colloidal Silica Suspensions are ideal for the final polishing of materials for which a high quality, visibly scratch free surface is required. Three new formulations are provided, each with a specific average particle size and with increased alkalinity for an enhanced Chemical-Mechanical Polishing (CMP) effect.
PELCO® Colloidal Silica CS1 with an average particle size of 80nm and pH value of 9.9 is ideal for many metallographic final polishing applications.
PELCO® Colloidal Silica CS2 with an average particle size of 50nm and pH value of 9.9 formulated for fine polishing of semiconductor wafers and devices.
PELCO® Colloidal Silica CS3 with an average particle size of 35nm and pH value of 10.5 formulated specifically for fine polishing of silicon wafers and devices.