Omniprobe® Lift-Out Grids

The Omniprobe® Lift-Out Grids are specifically designed to accept the TEM lamellas milled out by FIB or SEM/FIB systems. Typical thickness of the grids is 25-30µm with a diameter of 3mm. The posts are designed for optimum access and provide a secure area for attaching (welding) the lamella(s). The Omniprobe® grids fit standard TEM holders and provide a non-obscured view of the thin sections attached to the posts.
Available in standard Cu with 3, 4 and 5 posts and in Mo With 3 and 4 posts. All Lift-Out Grids have multiple indexed mounting positions for easy identification and positioning in the TEM.

1. Omniprobe® Lift-Out Grids, Cu with 3 posts, pkg/100
2. Omniprobe® Lift-Out Grids, Cu with 3 posts, shallow downset, pkg/100
3. Omniprobe® Lift-Out Grids, Mo with 3 posts, pkg/25
4. Omniprobe® Lift-Out Grids, Cu with 3 posts and side access, pkg/100
5. Omniprobe® Lift-Out Grids, Cu with 4 posts, pkg/100
6. Omniprobe® Lift-Out Grids, Mo with 4 posts, pkg/25
7. Omniprobe® Lift-Out Grids, Cu with 5 posts, pkg/100
8. Omniprobe® Beryllium Half Ring Grids, Be, pkg/10

PELCO® FIB Lift-Out TEM Grids – Available in Cu, Mo and Si

The PELCO® FIB Lift-Out TEM Grids have been designed for in-situ lift to attach the TEM lamellas milled out by SEM/FIB or FIB systems. The design has been optimized for access and flexibility. The nominal diameter of the sturdy PELCO® FIB Lift-Out Grids is 3mm. These grids fit an all standard TEM holders and provide a full view of the thin section attached to the posts.