A non-crystallizing silica (SiO2) suspension stabilized at an alkaline pH value of 9.8. The combination of very fine abrasive particles in a chemically aggressive liquid provides a Chemical-Mechanical Polishing (CMP) action. Ideal for final polishing to obtain a deformation-free surface. Obtain excellent results on IC-cross sections, ceramics, minerals, hard steels and ductile non-ferrous materials. Recommended as final polishing for EBSD samples.
Supplied in 32 oz bottle (950ml) with a 40% particle concentration in water, pH range 9.7-9.9.
Colloidal Silica Suspension, 0.06µm, 32 oz. (950ml)