1", 2", 3", 4" and 6" Silicon Wafers

These 1", 2", 3", 4" and 6" diameter silicon wafers can be used either as a substrate for thin film research or to make small silicon substrates by dicing the wafer into smaller pieces using a scriber and the Wafer Cleaving / Glass Breaking Pliers. The wafer is shipped in a wafer carrier.

Wafer Mounting Film

Properties:

1. Orientation: <100> for 1", 2", 4"and 6" wafer <111> for 3"
2. Resistance: 1-30 Ohms
3. Type P: (Boron) (1 primary flat)
   
4. Type N: Phosphorous doped (1 primary flat)
5. No SiO2 top coating
6. Wafer thickness:
   Ø1" = 10 - 12 mill (254 - 304µm) Type P / <100>
   Ø2" = 9 - 13 mill (230 - 330µm) Type P / <100>
   Ø3" = 13.6 - 18.5 mill (345 - 470µm) Type P / <111>
   Ø4" = 18.7 - 22.6 mill (475 - 575µm) Type P / <100>
   Ø6" = 23.6 - 25.2 mill (600 - 690µm) Type P / <100>
   Ø1" = 10 - 12 mill (254 - 304µm) Type N / <100>
   Ø2" = 9 - 13 mill (230 - 330µm) Type N / <100>
   Ø3" = 13.6 - 18.5 mill (345 - 470µm) Type N / <100>
   Ø4" = 18.7 - 22.6 mill (475 - 575µm) Type N / <100>
   Ø6" = 23.6 - 25.2 mill (600 - 690µm) Type N / <100>
   Roughness: 2nm
7. TTV: = <20µm
8. Wafer is polished on one side
   
   

16011- Ø1" Silicon Wafer, Type P / <100>

16012- Ø2" Silicon Wafer, Type P / <100>

16013- Ø3" Silicon Wafer, Type P / <111>

16010- Ø4" Silicon Wafer, Type P / <100>

16015- Ø6" Silicon Wafer, Type P / <100>

21601 - Ø1" Silicon Wafer, Type N / <100>
21602 - Ø2" Silicon Wafer, Type N / <100>
21603 - Ø3" Silicon Wafer, Type N / <100>
21604 - Ø4" Silicon Wafer, Type N / <100>
21606 - Ø6" Silicon Wafer, Type N / <100>