1", 2", 3", 4" and 6" Silicon Wafers

These 1", 2", 3", 4" and 6" diameter silicon wafers can be used either as a substrate for thin film research or to make small silicon substrates by dicing the wafer into smaller pieces using a scriber and the Wafer Cleaving / Glass Breaking Pliers. The wafer is shipped in a wafer carrier.

Wafer Mounting Film

Properties:

1. Orientation: <100> for 1", 2", 4"and 6" wafer <111> for 3"
2. Resistance: 1-30 Ohms
3. Type P: (Boron) (1 primary flat)
4. No SiO2 top coating
5. Wafer thickness:
   Ø1" = 10 - 12 mill (254 - 304µm)
   Ø2" = 9 - 13 mill (230 - 330µm)
   Ø3" = 13.6 - 18.5 mill (345 - 470µm)
   Ø4" = 18.7 - 22.6 mill (475 - 575µm)
   Ø6" = 23.6 - 25.2 mill (600 - 690µm)
   Roughness: 2nm
6. TTV: = <20µm
7. Wafer is polished on one side
   
   

16011 - Ø1" Silicon Wafer, Type P / <100>

16012 - Ø2" Silicon Wafer, Type P / <100>

16013 - Ø3" Silicon Wafer, Type P / <111>

16010 - Ø4" Silicon Wafer, Type P / <100>

16015 - Ø6" Silicon Wafer, Type P / <100>