The Omniprobe® Lift-Out Grids are specifically designed to accept the TEM lamellas milled out by FIB or SEM/FIB systems. Typical thickness of the grids is 25-30µm with a diameter of 3mm. The posts are designed for optimum access and provide a secure area for attaching (welding) the lamella(s). The Omniprobe® grids fit standard TEM holders and provide a non-obscured view of the thin sections attached to the posts.
Available in standard Cu with 3, 4 and 5 posts and in Mo With 3 and 4 posts. All Lift-Out Grids have multiple indexed mounting positions for easy identification and positioning in the TEM.
PELCO® FIB Lift-Out TEM Grids – Available in Cu, Mo and Si
The PELCO® FIB Lift-Out TEM Grids have been designed for in-situ lift to attach the TEM lamellas milled out by SEM/FIB or FIB systems. The design has been optimized for access and flexibility. The nominal diameter of the sturdy PELCO® FIB Lift-Out Grids is 3mm. These grids fit an all standard TEM holders and provide a full view of the thin section attached to the posts.