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    Scientists and engineers in both academia and industry are constantly facing new challenges that require highly localized characterization of a wide range of samples and materials. The ongoing drive to improve the quality of these materials means that structural and compositional information at the nanoscale is frequently necessary. FIB-SEM instruments generate exactly this kind of data by combining the precise sample modification of FIB with the high-resolution imaging of SEM.

    Products

    Helios MX1 PFIB-SEM
    • Multi-ion plasma FIB (Xe⁺ / Ar⁺) for versatile milling.
    • Ultra-high-resolution SEM imaging for detailed surface analysis.
    • Automated 3D reconstruction workflows for complex structures.
    • Virtual slice metrology enabling precise CD trend monitoring.
    • High-throughput volume removal with currents up to 6 μA.
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    Helios 6 HXS FIB-SEM
    • AI-powered automation for TEM sample preparation workflows.
    • Machine learning-assisted endpointing for sub-20 nm lamella accuracy.
    • Advanced Osprey FIB column optimized for low-kV performance.
    • Fully digital scan and deflection engine for precise cut placement.
    • Integrated AutoTEM 6 Professional software for streamlined operations.
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    Helios 6 HX FIB-SEM
    • AI-powered automation for high-volume TEM sample preparation workflows.
    • Machine learning-assisted endpointing for sub-20 nm lamella thickness accuracy.
    • Advanced Osprey FIB column optimized for low-kV milling and precision cuts.
    • Fully digital scan and deflection engine for accurate patterning and placement.
    • Integrated AutoTEM™ 6 Professional software for streamlined, unattended operations.
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    Helios 6 HD FIB-SEM
    • Osprey FIB column with automated alignments for improved low-kV milling.
    • Digital scan engine enabling simultaneous SEM imaging and FIB milling.
    • AI-enabled AutoTEM™ 6 software for fully automated in situ lift-out workflows.
    • EasyLift™ NanoManipulator for precise TEM sample handling and reduced downtime.
    • Enhanced end-pointing accuracy for high-quality, repeatable TEM sample preparation.
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    Hydra Bio Plasma-FIB
    • Four plasma ion species (Xe, Ar, O, N) for optimized milling across sample types.
    • Cryo-ready infrastructure with 360° rotatable stage and integrated cryo-transfer system.
    • Automated lamella preparation for cryo-electron tomography with EasyLift™ workflow.
    • Spin Mill Bio Method for large-area planar milling and smooth surfaces down to 5 nm slices.
    • AI-driven acquisition protocols for high-resolution volume EM at cryogenic and room temperatures.
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    Helios 5 EXL DualBeam
    • Full-wafer FIB-SEM system for 300 mm wafers and advanced process nodes.
    • Phoenix Ion Column delivering revolutionary low-kV performance for TEM prep.
    • Elstar Electron Column with UC monochromatic technology for high-resolution imaging.
    • AutoTEM™ 5 software with machine learning for precise end-pointing and multi-site workflows.
    • Optional Automated FOUP Loader for fab integration and high-throughput automation.
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    Helios 5 DualBeam
    • High-resolution imaging with Elstar™ electron column for superior materials contrast.
    • Tomahawk™ ion column enabling fast, precise TEM and STEM sample preparation.
    • Advanced automation with AutoTEM™ 5 software for unattended workflows.
    • FLASH image tuning for rapid, high-quality image acquisition without manual alignments.
    • Optimized for subsurface and 3D characterization across challenging sample.
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    Helios 5 PFIB DualBeam
    • Gallium-free TEM and APT sample preparation with Xe⁺ plasma FIB column.
    • Next-generation 2.5 μA xenon PFIB for high-throughput 3D characterization and micromachining.
    • Advanced automation with AutoTEM™ 5 for multisite in situ and ex situ workflows.
    • Elstar™ electron column with UC+ monochromator for sub-nanometer imaging at low energies.
    • Integrated SmartAlign and FLASH technologies for rapid, artifact-free imaging and navigation.
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    Helios Hydra 5+ PFIB-SEM
    • Four fast-switchable plasma ion species (Xe, Ar, O, N) for versatile milling and polishing.
    • Ga⁺-free TEM and APT sample preparation with ultra-low-energy final polishing.
    • Next-generation PFIB column delivering up to 2.5 μA for high-throughput 3D characterization.
    • Integrated AutoTEM™ and Auto Slice & View™ software for automated multisite workflows.
    • Elstar™ UC+ electron column for sub-nanometer imaging and highest materials contrast.
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    Helios Hydra 5 PFIB-SEM
    • Four fast-switchable plasma ion species (Xe, Ar, O, N) for flexible milling and polishing.
    • Ga⁺-free TEM and APT sample preparation with ultra-low-energy finishing.
    • High-throughput PFIB column delivering up to 2.5 μA for large-volume removal.
    • Integrated AutoTEM™ and Auto Slice & View™ software for automated workflows.
    • Elstar™ UC+ electron column for sub-nanometer imaging and superior contrast.
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    FIB-SEM and Laser Ablation
    • TriBeam architecture combining PFIB, SEM, and femtosecond laser for ultra-fast material removal.
    • Femtosecond laser ablation enabling millimeter-scale cross-sections in under five minutes.
    • Minimal thermal artifacts—clean surfaces suitable for direct SEM imaging and EBSD mapping.
    • Integrated Auto Slice & View™ software for automated 3D reconstruction and subsurface analysis.
    • High-throughput TEM and APT sample preparation with advanced automation workflows.
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    Arctis Cryo-Plasma-FIB
    • Fast-switchable plasma ion source (Xe, Ar, O) for high-quality lamella preparation.
    • Integrated fluorescence microscope (iFLM) for precise correlative targeting.
    • Autoloader system enabling robotic sample handling and direct connectivity to cryo-TEM.
    • Automated multi-day lamella preparation with web-based remote setup f.
    • Compact cryo-box and biosafety enclosure ensuring ultra-clean environment and minimized contamination risks.
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    Aquilos 2 Cryo-FIB
    • Dedicated cryo-DualBeam system for high-end cryo-TEM tomography workflows.
    • Integrated fully rotatable cryo-stage and cryo-hardware to maintain vitrified sample integrity.
    • Automated batch cryo-lamella milling with extended run times for overnight operations.
    • Correlative imaging with iFLM system combining fluorescence and electron microscopy in one chamber.
    • EasyLift™ NanoManipulator for precise cryo-lift-out of site-specific regions from bulk-frozen samples.
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    Scios 3 FIB-SEM
    • Ultra-high-resolution SEM imaging with NICol electron column for nanoscale detail.
    • Trinity Detection Technology for simultaneous SE and BSE imaging with maximum contrast.
    • Automated cross-section analysis for precise subsurface characterization and reduced user intervention.
    • High-quality, site-specific TEM/STEM sample preparation integrated with AutoTEM™ 5 software.
    • Optional Auto Slice & View™ 5 for fully automated 3D characterization and multi-modal data acquisition.
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    Applications

    Not sure which system best fits your needs?

    Our team can help you compare options and determine the right configuration for your application.

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