Copper PELCO® FIB Lift-Out Grid TEM Grids
The typical thickness of the copper lift-out grids is 35µm +/-5µm. The Cu FIB lift-out grids also have a thinner ridge on the inside, where the lamellas can be attached and are protected when stored. Available with either one or two wider v-shaped posts or four narrow flat posts with identification number etch through. Use single or dual wider posts for attaching single lamellas or the four posts for attaching a larger number of lamellas. Size of wide post is 250 x 35 x 190µm (W x D x H), size of narrow post is 80 x 35 x 190µm (W x D x H). Sold in packs of 100. FIB grid with 2 wide posts available with thickness of 55µm ±5µm as well.
PELCO® FIB Lift-Out TEM Grids – Available in Cu, Mo and Si
The PELCO® FIB Lift-Out TEM Grids have been designed for in-situ lift to attach the TEM lamellas milled out by SEM/FIB or FIB systems. The design has been optimized for access and flexibility. The nominal diameter of the sturdy PELCO® FIB Lift-Out Grids is 3mm. These grids fit an all standard TEM holders and provide a full view of the thin section attached to the posts.